EPD

image

Reliable Optical Endpoint Detection Systems

VEP™ Series are stable and well-defined s/w frame with various functions. We provide integrated solutions for epd, process chamber status ,film thickness measuement and cleanning optimization. We have three type products : VEP™-G&A / VEP™-Mono / VEP™-IEP

VEP™

To keep integrity of the stop layer and etch to a remaining amount of material, We need to know the endpoint. VEP™ was designed for detecting precise end point detection. Also we provide integrated solutions for gas chemistry changes through the optical emission.

Characteristics

  • Trace the selected wavelength intensity
  • End Point Detecting Function by pre-defined rule
  • Optical Emission Spectra-scope Function
  • Signal processing (Virtual data generation)
  • Simulation Function – Raw Data reprocess
  • Spectrum Libraries of Chemical Elements
  • Advanced algorithm - PCA/HMM
  • Plasma Triggered Process control
  • Run info achieved by VEP™ own Interface or SECS/GEM & HSMS
  • Customize EQ interface.
Vep System

Classification

There are two types of VEP™ according to CCD : VEP™-Genearl & VEP™-Advanced

General Advanced
Size 162 X 140 X 70 215 X 184 X 142
Resolution (Slit/10um): 2.0nm (Slit/10um): 2.0nm
Pixel 2048 2048
Wavelength UV/VIS UV/VIS
CCD Type Normal Array CCD Back-thinned CCD
Interface LAN LAN
Controller Each Chamber Each Chamber
Application EPD EPD

VEP™ - MONO

VEP-Mono is designed for replacing monochromator type epd called old epd system. Legacy Monochromators has several problems like general maintenance and data analysis. If you have a defect wafer and would like to know detailed main cause, it is difficult to analyze what the problem is.

VEP™ - MONO

Advantages

ITEM Monochrometer VEP™-Mono
Chamber Down Time Happen by EPD Fail No
Defect Wafer Happen by EPD Fail No
Plasma Monitoring Only specific wavelength Full Wavelength
Analysis Tool No Yes
FDC co-relation No Support
System Performance Old System New System
Leak Detection No Yes
Mechanical Parts Exist No
Support (H/W & S/W) Poor Good
Maintenance Need No Need

Characteristics

Flexibilities - Parallel Usage ESM allows operation the old Monochromator EPD and VEP™-Mono together

ESM

VEP™ - IEP (Insitu-Thickness Monitoring)

VEP™ IEP is designed for a wide variety of film thickness and depth measurement in real time required ETCH, CVD and CMP process. VEP™-IEP calculates the etching and coating speed of the monitored area by the interference intensity.

image